معدات التغليف شبه الموصل عالية الدقة LED Die Bonder Die Bonding Machine

Name: معدات التغليف شبه الموصل عالية الدقة LED Die Bonder Die Bonding Machine
Uploaded: 2026-02-07CST01:59:28-06:00
Duration: 38 s
Description: Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.

مجموعة: فيديوهات أخرى

وقت الإصدار: 2025-04-24

الكلمة الرئيسية: معدات خط SMT

وصف الفيديو

Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.